Booth number: F-14-20

About us

The Fraunhofer Institute for Non-Destructive Testing develops and applies new inspection techniques for a broad variety of applications. Based on ultrasonic, electromagnetic and x-ray methods, new devices for laboratory use or inline inspection are offered to enhance safety, quality and economical success in high-tech industries.


Contact in Japan:
Fraunhofer Representative Office Japan
German Cultural Center 1F
Akasaka 7-5-56, Minato-ku
Tokyo 107-0052
Japan

Phone: +81 3 35867104
Fax: +81 3 35867187
E-mail: info@fraunhofer.jp

Address
Fraunhofer Institute for Non-Destructive Testing
Dresden branch
Maria-Reiche-Str. 2
01109 Dresden
Germany

Phone: +49 351 88815-501
Fax: +49 351 88815-509

Products and services

Inline metrology for conductive thin films

Need and requirements for non-destructive testing of electronic components are growing with the increasing complexity of fabrication processes. Complex products have to be transferred to a stable mass production. Moreover, these products have to function with highest reliability throughout the whole life cycle.

Fraunhofer IZFP presents a new device for inline inspection of thin conductive films, e.g. for application in the solar cell mass production.

The device presented allows non-contact thickness measurements of conductive films. The resolution achieved e.g. for copper films deposited on silicon is better than 5 nm. Due to its easy handling and the absence of any mechanical components the device can be integrated into vacuum chambers and may be used in harsh environments (warm humidity or aggressive media).

The newly developed "EddyCus Pro100" facilitates characterization and thickness measurements of thin layers by using the eddy current technique:

• Thickness measurement of conducting layers with a resolution of
  1 - 10 nm (depending on the layer material)
• Thickness measurement of more than one conducting layer in a multi-layer-system
• Characterization of material properties like microstructure and hardness of thin conducting layers of electronic components
• Characterization of surface roughness.

EddyCus Pro100 works with high speed and precision and can be easily applied to quality control in production processes based on thin film technology.

Nanoeva®, the Competence Center for High-resolution Nondestructive Testing in Packaging Technology

Nanoeva, a joint center of IZFP and Technische Universität Dresden for nondestructive testing of packaging technologies in electronics, offers the development of customized testing devices, services, and training to customers from enterprises and research institutes. Know-how transfer includes the development and application of new testing methods with which defect types like the transportation phenomenon, re-crystallization, volume modifications, and Kirkendall voids can be resolved. The customers gain substantial competition advantages by getting advisory service, training, and having access to state-of-the-art testing and analysis equipment in Nanoeva labs.